Diamonds can't be cut directly, nor can they be cut conveniently (for specific reasons, you can try it yourself, and writing it on paper with a 5mm long pencil lead may be a bad metaphor). You need to make cutting tools (diamond saw, diamond wire saw, etc. ). Diamond cutting line is popular recently.

Diamond line is the abbreviation of diamond cutting line. Some people call it a diamond cutting line or a diamond line. Many things in industry are cut by wire cutting, such as polysilicon slices in photovoltaic field. The material of the cutting line is very important. At present, the mainstream silicon wafer cutting line used in photovoltaic field is ultra-fine cutting steel wire with a diameter of about 100 micron. As the name implies, the diamond cutting line is related to diamonds. Generally speaking, it is a diamond cutting line formed by tiny diamond particles embedded in the line. As we all know, diamond is a superhard and widely used cutting material. Diamond wire has diamond micro-serrations, which increases the cutting ability of steel wire and can greatly speed up the cutting speed. Diamond wire is a revolutionary progress in the cutting industry of solar silicon materials. Therefore, it is widely expected that it will be widely used in the future. Diamond wire has many advantages: 1. High-speed cutting can be realized, the cutting speed can be doubled, and the time consumption is naturally reduced. It can accomplish more work per unit time, which is its greatest advantage. 2. Environmental protection production, the process of diamond wire only needs water or water-based cooling cleaning solution, which truly realizes environmental protection production and manufacturing. However, there are still many shortcomings in the current diamond wire technology, mainly: 1. High cost, relatively new technology, not yet popularized. The main diamond wire depends on imports, and the supply of diamond wire from domestic companies is still relatively small, so the price is relatively high. 2. The wire is too thick, which leads to large silicon wafer loss. The loss of silicon wafer is directly related to the thickness of the cutting line, and the thicker it is, the more natural loss it will be. At present, the mainstream cutting line is ultra-fine cutting steel wire with a diameter of about 100 micron. In practical application, the diameter of diamond wire is about 250 microns, which is more than twice that of ultra-fine cutting steel wire. 3. There will be cuts, resulting in low conversion efficiency of crystalline silicon batteries. Therefore, at present, diamond wire is mainly used in the rough machining field of silicon wafer, for example, it has been applied to the square root of silicon ingot. Ultra-fine cutting steel wire is still used in the field of finer slicing. At present, the preparation technology of diamond wire is not very popular. The technology in the west and Japan is relatively developed, and many companies in China are working hard. At present, many companies claim to have been able to produce diamond cutting lines with a diameter slightly higher than 100 micron. It is expected that diamond wire will not be able to replace the existing ultra-fine cutting steel wire in the field of fine cutting (which is also the main field of silicon wafer processing) until the thinner diamond wire can be developed and widely used and the notch problem is solved. However, the technical progress in this area is still quite fast, and maybe diamond thread will be the mainstream in the near future.