Spreadtrum sits on half of TD
As one of the leading suppliers of mobile phone chips in China, Spreadtrum Communications (Shanghai) Co., Ltd. has been committed to independent innovation. At present, the product series of baseband and RF chips of 2G/2.5G/3G/3.5G mobile communication technology has been formed, and national key research projects such as TD-SCDMA, TD-LTE core chip development and industrialization have been completed. In 20 1 1 year, the sales volume of Spreadtrum communication chips exceeded 200 million, and it also became one of the four mobile phone chip suppliers in the world. Relevant data show that Spreadtrum occupied 55% market share in TD terminal chip market in 20 1 1 year. Spreadtrum was the first to release a multimode mobile phone single chip supporting TD-LTE/TD-SCDMA/GSM in early 20 12, and will launch a multimode mobile phone single chip supporting five communication systems and 12 communication frequency band in 20 13.
Balanced development of Schlanwei IDM model
Anyone familiar with Hangzhou Shi Lan Microelectronics Co., Ltd. knows that the core development concept of the company is "honesty, patience, exploration and enthusiasm". After 15 years' development, Silanwei has become one of the largest IC chip design and manufacturing enterprises in China, and its overall production and operation scale ranks among the top in the domestic integrated circuit industry. The three major businesses of integrated circuit chip design, silicon wafer manufacturing and LED chip manufacturing have achieved rapid development. At the same time, Silanwei also actively explored emerging business markets and entered LED and other industries, bringing new growth points to the company. In the LED chip manufacturing business, Slam Mingxin, a subsidiary of Slam Micro, has been at the forefront of domestic peers in brand building and production scale expansion.
Huada highlights its core and strengthens research and development.
China Huada Integrated Circuit Design Group Co., Ltd., established in 2003, is a large state-owned integrated circuit design enterprise. After several years of resource integration, 18 second-and third-tier enterprises have been integrated into six core enterprises, which has strengthened the development ability of the group's main business. By targeting emerging markets, constantly strengthening leading products of enterprises and taking the road of professional development, it has formed core businesses in six fields, including smart card products, information security products, communication chips, consumer chips, high-tech electronics and testing services. Core business and leading products need the support of advanced technology. 20 1 1 year, Huada Group invested more than 350 million yuan in R&D, up 23% over the previous year, and the proportion of scientific and technological investment reached 26%.
SMIC Chinese mainland OEM bibcock
SMIC International Integrated Circuit Manufacturing Co., Ltd. is the largest and most advanced integrated circuit chip foundry enterprise in Chinese mainland. In terms of technology, Chinese mainland took the lead in realizing mass production of 65nm/55nm technology; Have the most advanced 45nm/40nm trial production technology in Chinese mainland; It has the only research and development capability of 32nm/28nm process in Chinese mainland. It is planned to basically realize the 28nm process at the end of the second quarter and the beginning of the third quarter of 20 13, and realize the 22nm/20nm process at the end of 20 15. On the one hand, SMIC has completed this process and formed its own characteristics; On the other hand, actively evolve to advanced technology. At present, SMIC has become the first choice for Chinese mainland customers in mature technology and mainstream technology.
China Resources promotes its strength through simulation.
China Resources Microelectronics Co., Ltd. is the only semiconductor company in China that has a complete industrial chain of open wafer foundry, design, test and packaging, and discrete device manufacturing. After entering the microelectronics industry from 1997, after more than ten years of development, it has become a leader in the field of OEM of new power devices and characteristic wafers in China and the lead implementer of major national projects. During the "Eleventh Five-Year Plan" and "Twelfth Five-Year Plan", China Resources Microelectronics took the lead in organizing and implementing five national special projects related to wafer technology. Outstanding achievements have been made in the development of new processes, new technologies and new products. A number of special technological achievements are at the leading level in China, occupying a place in national strategic fields such as Internet of Things, power electronics and automobile electronics, and shortening the gap with the international advanced level.
Hua Hong NEC characteristic craft platform wins.
Hua Hong NEC Electronics Co., Ltd., as an OEM based on characteristic technology, has mastered a large number of key technologies of integrated circuits through continuous technology introduction, digestion, absorption and redevelopment, and can provide semiconductor technology from 1.0 micron to 0. 13 micron, thus forming a characteristic technology platform with world-leading technical solutions and process manufacturing capabilities. Among them, embedded nonvolatile memory technology, high-voltage field effect transistor technology and power device technology have reached the international leading level, and radio frequency (RF) communication device technology, analog and power management device technology have reached the domestic leading level. These five characteristic technologies make Hua Hong NEC have strong technical advantages and market competitiveness in the same industry.
Li Hong's manufacturing services have high added value.
Shanghai lihong semiconductor manufacturing co., ltd is a global leader in NOR flash memory technology. At the same time, it can provide an advanced technology platform in logic, nonvolatile memory, mixed signal, radio frequency, high voltage devices and static memory. Li Hong has been focusing on the development of differentiated technologies, promoting diversified design schemes for different applications and providing customers with high value-added manufacturing service technologies. Based on its design scheme, customers can design on Li Hong Semiconductor's silicon verification technology platform, which is more efficient and less risky. Rich, high-performance and silicon-verified IP module series play a complementary role in the existing IC design of customers.
Xinchao technology high-end packaging leading
Jiangsu Xinchao Technology Group Co., Ltd. is the largest packaging and testing enterprise in China and the first listed company in the domestic packaging and testing industry. Based on the tenet of "leading technology and satisfying customers", Changdian Technology keeps forging ahead and strives for innovation. After more than ten years' efforts, it has not only achieved the largest packaging and testing service enterprise with the most complete varieties, the most advanced technology and the most perfect service in China, but also developed a series of new packaging and testing technologies with independent intellectual property rights, and began to occupy the commanding heights of international packaging and testing technologies. It is particularly worth mentioning that the patented technology of copper bump packaging and pre-packaged interconnection system has become the mainstream of the international semiconductor industry and has been widely used. In addition, Changdian Technology has also made great progress in advanced packaging technologies such as silicon perforation, RF SiP packaging and testing, 3D chip and package stacking, and MEMS multi-chip packaging.
Nantong Huada's independent innovation fills the gap
Since its establishment, Nantong Huada Microelectronics Group Co., Ltd. has been paying attention to introducing, digesting and absorbing international advanced packaging and testing technology, and implementing re-innovation on the basis of digestion and absorption. Independent research and development of a number of domestic leading and international advanced packaging and testing technologies, such as LQFP, TQFP, CSP, MCM, MEMS, lead-free electroplating, strip test(strip test technology is the first in China). The scale of the enterprise is constantly expanding, and the product level is improving year by year. Over the years, Nantong Huada Group and its holding company Nantong Fujitsu have successively implemented and completed more than ten national torch plan projects, provincial and municipal scientific and technological innovation projects and technological transformation projects, and achieved a series of scientific and technological innovation achievements: 25 key technologies have made breakthroughs; The developed BUMP technology is applied to high-end fields such as CPU and GPU, which fills the gap in China. Develop and mass-produce all kinds of highly reliable automotive electronic products.
China's microelectronics power devices are leading in China.
As a major power semiconductor enterprise in China, Jilin Hua Microelectronics Co., Ltd. actively pays attention to the development trend of semiconductor industry and actively communicates with customers. Huawei attaches great importance to R&D. By increasing the investment of new products in R&D, it constantly improves its technological innovation capability, provides guarantee for continuous product innovation, and further enhances its competitiveness. Through the optimization of old products and the development of new products, the profitability and competitive advantage of products are improved, and at the same time, through the realization of large-scale production, the production capacity is further released, the sales volume of products is increased, and the profit space of products is improved. At present, many products have reached the domestic advanced level.