In fact, combing the upstream materials of semiconductor upstream materials company chips has been briefly mentioned in the article introducing the second phase of the National Fund. Today, we will do a comprehensive combing of the material side again. Semiconductor materials include photoresist, target, special gas, etc. This should be known to many friends. At present, only about 15% of these semiconductor materials are made in China. In the case of blocking relevant industrial chains abroad, domestic substitution is still the focus. According to the reports disclosed by the agency, the number of reports of upstream semiconductor materials is increasing, and the trend of localization will continue in the future. These materials can be divided into three categories: basic materials, manufacturing materials and packaging materials. Basic materials Basically, materials can be divided into silicon wafers and compound semiconductors. Silicon wafer is the most important raw material in the manufacturing process of integrated circuits. Related listed companies: Shanghai Xinyang, Jingsheng Electromechanical, and Zhonghuan. Compounds mainly refer to gallium arsenide (gaas), gallium nitride (gan) and silicon carbide (sic). Recently fried gallium nitride is also among them, so it is not new. Listed companies: Sanan Optoelectronics, Wen Tai Science and Technology, Hite High-tech, Silanwei, Fuman Electronics, Naiwei Technology, Hailu Heavy Industry, Yunnan Germanium Industry, Ganzhao Optoelectronics and other manufacturing materials. Manufacturing materials can be divided into six categories: electronic special gas, sputtering target, photoresist, polishing material, mask and wet electronic chemicals. Electronic special gas Special gas is an important branch of special gas, and it is an indispensable raw material for electronic industry production such as integrated circuit (ic), display panel (LCD, organic light emitting diode), photovoltaic energy, optical cable and so on. It is widely used in thin film, lithography, etching, doping, vapor deposition, diffusion and other processes, and its quality has an important impact on the performance of electronic components. Related listed companies: Walter Gas, Jacques Technology, Nanda Optoelectronics and Hangyang. Sputtering target In the high-tech chip industry, sputtering target is an essential raw material for VLSI manufacturing. It uses the ions generated by the ion source to accelerate and gather in high vacuum to form a high-speed ion beam and bombard the solid surface. Ions exchange kinetic energy with atoms on the solid surface, which makes the atoms on the solid surface leave the solid and deposit on the substrate surface. The bombarded solid is the raw material for sputtering deposition of thin films, which is called sputtering target. Target is the core material of sputtering process. At present, there are only four listed companies engaged in sputtering targets in the A-share market: Ashichuang, Youyan New Materials, Jiangfeng Electronics and Longhua Technology. Photoresist Photoresist is a key material for micro-pattern processing in the electronic field, which plays an important role in the production of semiconductor, LCD, PCB and other industries. Photoresist is a pattern transfer medium that transfers the required fine pattern from the mask to the processing substrate through photochemical reaction, and it is the key material for processing fine pattern circuits in the photoelectric information industry. Listed companies: Nanda Optoelectronics, Li Qiang New Materials, Jing Rui, Rong Da Photosensitive, Jinlong Electromechanical, Feikai Materials, Jianghua Micro, etc. Generally refers to the materials used in cmp chemical mechanical polishing process, which can be generally divided into polishing pad, polishing solution, regulator and cleaning agent, of which the first two are the most critical. The material of polishing pad is generally polyurethane or polyester containing saturated polyurethane, and the polishing solution is generally composed of ultrafine solid abrasive (such as nano-silica and alumina particles), surfactant, stabilizer and oxidant. Listed companies: Dinglong (polishing pad) and Anji Technology (polishing solution). Mask plate, also known as photomask, photomask and lithography mask, is the carrier of design pattern in semiconductor chip lithography process. Listed companies: Philippines and Shi Ying. Wet electronic chemicals, also known as ultra-clean and high-purity reagents, refer to various high-purity chemical reagents used in semiconductor manufacturing. Listed companies mainly include: Polyfluoride, Jing Rui and Jiang Huawei. Packaging materials Packaging materials can be subdivided into six categories: chip bonding materials, bonding wires, ceramic packaging materials, lead frames, packaging substrates and cutting materials. Chip bonding material is a kind of material that connects the chip with the substrate or packaging substrate by bonding technology. Listed companies: Feikai materials and Hongchang electronic ceramic packaging materials are electronic packaging materials, which are used to undertake the functions of mechanical support, environmental sealing and heat dissipation of electronic components. Related listed companies: The packaging substrate of Sanhuan Group is the most expensive part of the packaging materials, which mainly plays the role of bearing the protection chip and connecting the upper chip and the lower circuit board. Related companies: Xingsen Technology, Shennan circuit bonding wire, bonding wire for semiconductor, which is used to connect the chip and the bracket by welding and undertake the key electrical connection function between the chip and the outside world. Related listed companies mainly include: Kangqiang electronic lead frame, as the carrier of semiconductor chip, is the key structural component to realize the electrical connection between the internal circuit terminals of the chip and the external circuit (pcb) through bonding wires and form an electrical loop. Related listed company: Kangqiang Electronic Material Cutting. At present, the mainstream cutting methods are divided into two categories, one is cutting with marking system, and the other is cutting with laser. Relevant listed companies mainly include: Daile New Materials 20 18, and the global sales of semiconductor materials 501900 million US dollars, accounting for 23.4% of matrix materials, 38.7% of manufacturing materials and 28% of packaging materials.