1. The customer needs to tell the manufacturer the sample size, process requirements, product quantity and other relevant data through the drawing documents, and then a professional will quote for you, supervise the order and follow up the production situation.
2. According to customer's requirements, cut out qualified production plates from relevant plates.
Specific technology: large plates are cut, rounded, trimmed and discharged according to MI requirements.
3. Drill holes according to the drawing data, and drill holes meeting the size requirements at appropriate positions.
Specific process: check/repair the upper plate drilling and lower plate of laminated pin.
4. Copper deposition: a thin layer of copper is deposited on the surface of the insulating hole by chemical method.
The specific process: coarse grinding the hanging plate and dipping the copper wire into 1% dilute H2SO4 to thicken the copper.
5. Graphic transfer, that is, the graphics on the production film are transferred to the board.
Specific procedures: pressing the hemp board, standing the film, standing the contraposition exposure, and checking the film development.
6. Pattern electroplating: electroplate a layer of copper, gold, nickel or tin that meets the thickness requirements on the exposed copper skin or hole wall of the circuit pattern.
Specific processes: degreasing and cleaning the upper plate, secondary etching, cleaning, pickling, copper plating, cleaning, pickling, tin plating and cleaning the lower plate.
7. Remove the anti-electroplating coating with NaOH solution to expose the non-linear copper layer.
8, etching, using chemical reagent copper to react to remove the circuit part.
9. Green oil transfers the pattern of green oil film to the board, which mainly plays the role of protecting the circuit and preventing tin on the circuit when welding parts.
10, print characters on the circuit board, mainly the information of manufacturers and products.
Specific process: after the green oil is finally solidified, it is cooled and allowed to stand, and then the silk-screen characters are solidified.
1 1. Gold-plated finger, and nickel \ gold layer with required thickness is plated on the plug finger to make it more hard and wear-resistant.
12, forming, stamping with mold or CNC gong machine to make the shape required by customers. The molding methods are organic gong, beer board, hand gong and hand cutting.
13, testing, mainly through flying needle tester to test, detect circuit board open circuit, short circuit and other problems that are not easy to find by visual inspection.
Extended data:
Precautions for PCB proofing:
(1) In principle, the 8-shaped hole is designed as a slotted hole (annular hole) by PCB factory. Therefore, it is recommended that the layout be as round as possible. There is really no such function. You can put more than n circles and stack them as much as possible.
In this way, there will be no "dog wants teeth" in the final annular groove, and the plate factory will not break the drill bit because of your groove hole!
(2) The minimum aperture of mechanical drilling is 0.25mm( 10mil), and the general aperture design is 0.3mm( 12mil) or more.
If it is smaller than this or only 0.25mm, the people in the board factory will definitely look for you. Why? You can find the answer you want in (5).
(3) The minimum hole diameter is 0.25mm( 10mil), and the general hole diameter is designed to be above 0.3mm( 12mil). Same as (2)
(4) As a general practice, only the mechanical drilling unit is mm; Other units are millions. My habit of drawing is to use mil as the unit, except the library, because I want to use mm to measure the size, and the unit of mil is very small, which is really convenient.
(5) The aperture of laser drilling (laser) is generally 4 mils (0. 1 mm) -8 mils (0.2 mm). Generally, this technology will be used for boards with more than 6 floors and very dense boards.