If you want to make a small lamp with LED or LED lamp, you need a power supply and LED or LED lamp, as well as resistors and wires. Manufacturing process of light-emitting diode device: 1: after a certain current is injected, electrons and holes continuously flow through the PN junction or its similar structural surface, and spontaneously recombine to produce a light-emitting diode semiconductor device. Applied discipline: surveying and mapping (first-class discipline); Surveying and mapping instruments (two disciplines) definition 2: semiconductor light-emitting devices that can emit visible or invisible radiation when a forward current is applied to a semiconductor pn junction or similar structure. Applied discipline: mechanical engineering (first-class discipline); Instrumentation components (two disciplines); The LED manufacturing technology of display devices (third-level discipline) has been expanded to packaging 1. Inspection of LED chip and microscopic inspection: whether there are mechanical damages and pits on the surface of the material (whether the chip size and electrode size of Lockhill meet the process requirements and whether the electrode pattern is complete) 2. LED capacity expansion is not conducive to the subsequent process operation, because LED chips are still closely arranged (about 0. 1mm) after dicing. We use a film stretcher to expand the film of bonded chips, so as to stretch the spacing between LED chips to about 0.6 mm. Manual expansion is also possible, but it is easy to cause bad problems such as waste of chips. 3.LED dispensing: Apply silver glue or insulating glue to the corresponding position of the LED bracket. (For GaAs and SiC conductive substrates, red, yellow and yellow-green chips with back electrodes are made of silver paste. For blue and green LED chips with sapphire insulating substrate, insulating glue is used to fix the chips. ) The process difficulty lies in the control of dispensing amount, and the height and dispensing position of colloid have detailed process requirements. Because there are strict requirements for the storage and use of silver glue and insulating glue, the proofing, stirring and use time of silver glue are all matters that must be paid attention to in the process. 4. The glue preparation of 4.LED is opposite to dispensing. Glue-making is to apply silver glue to the electrode on the back of LED with glue-making machine, and then install the LED with silver glue on the back of LED bracket. The efficiency of dispensing is much higher than dispensing, but not all products are suitable for dispensing. 5. Manual pricking of LED: put the expanded LED chips (with or without glue) on the fixture of pricking table, put the LED bracket under the fixture, and stab the LED chips to the corresponding positions with needles under the microscope. Compared with automatic mounting, manual punching has an advantage that it is convenient to replace different chips at any time, and it is suitable for products that need to install multiple chips. 6.LED automatic mounting Automatic mounting is actually a combination of two steps: gluing (gluing) and pasting. First, apply silver glue (insulating glue) on the LED bracket, then suck up and move the LED chip with a vacuum nozzle, and then put it in the corresponding bracket position. In the process of automatic mounting, it is mainly necessary to be familiar with the equipment operation programming, and at the same time, to adjust the gluing and installation accuracy of the equipment. In the selection of suction nozzle, try to use bakelite suction nozzle to prevent damage to the surface of LED chip, especially for blue-green chip. Because the steel nozzle will scratch the current diffusion layer on the chip surface. The purpose of 7.7. LED sintering is to solidify silver paste, and the sintering needs to monitor the temperature to prevent batch defects. The sintering temperature of silver paste is generally controlled at 65438 050℃ and the sintering time is 2 hours. It can be adjusted to 170℃ and 1 hour according to the actual situation. Insulation glue is generally 150℃ 1 hour. The silver glue sintering furnace must be opened every 2 hours (or 1 hour) according to the process requirements to replace the sintered products, and it is not allowed to be opened at will. The sintering furnace shall not be used for other purposes to prevent pollution. 8. The purpose of LED bonding is to lead the electrode to the LED chip and complete the connection of the internal and external leads of the product. There are two bonding processes for LED: gold wire ball bonding and aluminum wire bonding. The picture on the right shows the bonding process of aluminum wire. Press the first point on the electrode of the LED chip, then pull the aluminum wire above the corresponding bracket, press the second point, and then pull the aluminum wire off. The gold wire ball welding process is to burn a ball first and then press the first point, and other processes are similar. Bonding is a key link in LED packaging process, and the main process to be monitored is the arch wire shape, solder joint shape and tension of bonding gold wire (aluminum wire). 9.LED sealant LED packaging mainly includes glue, potting and molding. Basically, the difficulties in process control are bubbles, lack of materials and black spots. The design is mainly about the selection of materials, and the combination of epoxy and bracket is selected. (Generally, LED can't pass the air tightness test) 9. 1LED dispensing Top LED and side LED are suitable for dispensing package. Manual dispensing packaging requires a high level of operation (especially white LED), and the main difficulty is to control the amount of dispensing, because epoxy will thicken during use. The dispensing of white LED still has the problem of color difference caused by phosphor precipitation. 9.2LED potting and packaging lamp -LED is encapsulated by potting. The process of potting is to inject liquid epoxy resin into the LED molding cavity, then insert the pressure welded LED bracket, put it in the oven to cure the epoxy resin, and then take the LED out of the molding cavity for molding. 9.3LED molding and packaging Put the pressure-welded LED bracket into the mold, close the upper and lower molds with a hydraulic press and vacuum, put the solid epoxy resin into the rubber channel of the mold with a hydraulic ejector pin, heat it at the entrance of the rubber channel, and the epoxy resin enters each LED molding groove along the rubber channel for curing. 10.LED curing and post-curing curing refer to the curing of the encapsulated epoxy. Generally, the curing conditions of epoxy are 135℃ and 1 hour. Molding and packaging are generally carried out at 150℃ for 4 minutes. Post-curing is to completely cure epoxy resin and thermally age LED. Post curing is very important to improve the bonding strength between epoxy resin and PCB. The general condition is 120℃ for 4 hours. 1 1.LED rib cutting and dicing Because LEDs are connected together (not single) in production, LEDs packaged in lamps all use rib cutting to cut off the connecting ribs of LED brackets. SMD-LED is on PCB, and it needs dicing machine to complete the separation. 12.LED testing Test the photoelectric parameters of LED, check the overall dimensions, and classify LED products according to customer requirements. 13.LED packaging will count and package the finished products. Ultra-bright LEDs need anti-static packaging.