Abbreviation: ABM (Asynchronous Balanced Mode)
Asynchronous balance mode
Classification: IP and multimedia
Explanation: A data communication mode controlled by high-level data link control (HDLC). Asynchronous means that there is no common clock for data transmission between two stations, and balanced means peer-to-peer communication between the two stations, which eliminates the "imbalance" between the master station and the slave station at both ends of the data link.
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ABM Company was founded in 1986 and its headquarters is in San Jose, Silicon Valley, USA. Mainly engaged in mask alignment exposure machine (mask aligner), individual exposure system, light intensity meter/probe. The company's main markets are America and Asia.
By the end of June 38, 2005, ABM had sold more than 300 (mask aligner) exposure machines and more than 50 independent exposure systems worldwide. The most famous customers are NASA, Intel and shipley, which produces photoresist. ABM mask aligner has the highest sales volume in Taiwan Province Province, and more than half of universities, research institutes and some factories are using ABM mask aligner. The main feature of ABM mask aligner is its high cost performance.
ABM is headquartered in Silicon Valley, USA, and its Asia-Pacific sales service and maintenance center is located in Hongkong, China. The company has agencies in China, Korean, Japanese, Indian, Singaporean, Malaysian and Taiwan Province Province in Asia. W.J.H Company is the exclusive agent of ABM in China.
application area
Electronic packaging (wafer bumps and wafer-level CSP)
Photoelectric equipment (light emitting diode, laser diode, waveguide array)
Detector (CCD, near/far infrared, real-time X-ray)
MEMS and MOEMS device displays (liquid crystal displays, polymer liquid crystal displays, organic light emitting diodes)
Suitable photosensitive layer is suitable for all kinds of photoresist and dry film, BCB, polyimide, SU-8, G, H, I line and deep ultraviolet exposure.
Suitable base semiconductor materials
Silicon, germanium silicon, SOI, SOS, GaAs, indium phosphide, indium antimonide, CZT, MCT, lithium niobate, timely, glass.
Flexible and rigid substrate (FR-4, BT- epoxy resin), Kapton, metal