As a new light source invented in the last century, laser has the characteristics of good directivity, high brightness, good monochromaticity and high energy density, and has been widely used in industrial production, communication, information processing, medical and health care, military, cultural education and scientific research. According to statistics, from high-end optical fiber to common bar code scanners, the market value of laser-related products and services reaches trillions of dollars every year. Chinese laser products are mainly used in industrial processing, occupying more than 4% of the market space.
as the most common application of laser system, laser machining mainly includes laser welding, laser cutting, surface modification, laser marking, laser drilling, micromachining, photochemical deposition, stereo lithography and laser etching.
laser processing equipment is one of the key technical equipment to transform traditional manufacturing industry by using laser processing technology. The main products include various laser marking machines, welding machines, cutting machines, dicing machines, engraving machines, heat treatment machines, three-dimensional molding machines and texturing machines. Such products have entered or are entering various industrial fields.
specific application of laser processing technology:
1. application in clothing industry
because laser processing technology has the characteristics of high automation, high processing accuracy, high speed, high efficiency and simple and convenient operation, it has adapted to the international fashion production technology trend, so laser processing technology and equipment are being popularized and popularized in the clothing industry at an alarming speed.
1. Application of laser cutting
In the process of laser cutting, the cloth will not be deformed or wrinkled, and the size precision of laser cutting is high, and the shape of laser cutting can be changed at will with the artwork, which increases the practicality and creativity of the design. In addition, laser cutting technology is to use a "laser knife" instead of a metal knife. Laser cutting any fabric can instantly melt and solidify the incision, with small gap and high accuracy to achieve the function of automatic "edge locking". The traditional process uses a knife die to cut or hot work, and the incision is easy to come off, yellow and hard.
2. Application of laser engraving
Laser engraving is automatic engraving by using software technology and inputting data according to design drawings. Laser engraving is the most mature and widely used technology of laser processing technology in clothing industry. It can engrave any complex graphic logo, and can also carry out hollow engraving and surface engraving, so as to engrave various patterns with different shades, different textures, layering and transitional color effects.
3. Application of laser marking
Laser marking has the characteristics of high marking accuracy, high speed and clear marking. Laser marking is compatible with the advantages of laser cutting and engraving technology, and can be used for precision machining on various materials, as well as processing small and complex patterns. Laser marking has anti-counterfeiting performance that will never wear out.
ii. application in electronic industry
laser processing technology belongs to non-contact processing mode, so it does not produce mechanical extrusion or mechanical stress, especially meeting the processing requirements of electronic industry. In addition, laser processing technology is widely used in electronic industry because of its high efficiency, no pollution, high precision and small heat affected zone.
1. Laser scribing
Laser scribing technology is the key technology to produce integrated circuits, with fine scribing, high precision (line width is 15-25μm, groove depth is 5-2μm), fast processing speed (up to 2mm/s), and the yield is over 99.5%. In the process of integrated circuit production, thousands of circuits should be prepared on a substrate, and they should be divided into individual dies before packaging. The traditional method is to cut with diamond grinding wheel, and the surface of silicon wafer produces radial cracks due to mechanical force. The laser scribing technology is used to scribe, and the laser beam is focused on the surface of the silicon wafer to generate high temperature to vaporize the material and form grooves. By adjusting the pulse overlap, the groove depth can be accurately controlled, so that the silicon wafer can be easily cut off neatly along the groove, or it can be cut directly after multiple cuts. Because the laser is focused into a very small spot and the heat affected zone is very small, when cutting a groove with a depth of 5μm, the temperature rise at the edge of the groove of 25μm will not affect the performance of the active device. Laser scribing is non-contact processing, and the silicon wafer will not be cracked by mechanical force. Therefore, the purposes of improving the utilization rate of silicon wafer, high yield and good cutting quality can be achieved. It can also be used for dicing monocrystalline silicon, polycrystalline silicon and amorphous silicon solar cells and dicing and cutting silicon, germanium, arsenic and other semiconductor substrate materials.
2. Laser trimming
Laser trimming technology can automatically and precisely trim the specified resistance, and the accuracy can reach .1%-.2%, which is more accurate and efficient than traditional methods and lower in cost. The resistors in integrated circuits and sensors are a resistive film, and the manufacturing error reaches 15-2%. Only by correcting them can the yield of those high-precision devices be improved. The laser can be focused into a small spot with concentrated energy, which has little thermal influence on the adjacent components during processing, does not produce pollution, and is easy to control by computer, so it can meet the purpose of quickly fine-tuning the resistance to achieve an accurate predetermined value. During processing, the laser beam is focused on the resistive film to vaporize the substance. When trimming, the resistance is measured first, and the data is transmitted to the computer. According to the pre-designed trimming method, the computer instructs the beam locator to make the laser cut the resistance along a certain path until the resistance reaches the set value. Similarly, the laser technology can be used to correct the capacitance of the chip capacitor and trim the hybrid integrated circuit. The superior positioning accuracy makes the laser fine-tuning system improve the output and circuit function in miniaturization of precise linear combination signal devices.
3. Laser marking
Laser marking is a marking method that uses high-energy density laser to irradiate the workpiece locally, so that the surface material vaporizes or undergoes a chemical reaction of color change, thus leaving a permanent mark. There are two ways of laser marking: engraving and mask imaging: mask marking uses laser to image the template pattern on the surface of the workpiece and ablate the mark. Engraving marking is a high-speed full-function marking system. The laser beam is reflected by a two-dimensional optical scanning galvanometer and then focused on the surface of the workpiece by a flat-field optical lens. Under the control of a computer, the material is vaporized according to the set trajectory, and various characters, symbols and patterns can be printed, with the character size ranging from millimeters to microns. The laser marking is permanent and not easy to wear, which is of special significance to the anti-counterfeiting of products. It has been widely used in branding electronic components, integrated circuits and numbering printed circuit boards. The UV-band laser technology has developed rapidly. Due to the electronic band transition of materials under the action of UV-wave laser, the bonding bonds between molecules are broken or weakened, so that the denudation processing is realized, and the processing edges are very neat, so it has sprung up in the laser marking technology, and it has been paid special attention to by the microelectronics industry.