I. Functions realized by chip package
1, transfer function
2. Transmission circuit signal
3. Provide cooling channels
4. Structural protection and support
Second, the main functions of the chip
1, complete the operation and handle the task.
2. The circuit is made on the surface of the semiconductor chip for operation and output specific instructions and data.
Three. Detailed description of chip manufacturing process
1, the raw material wafer of the chip, the component of the wafer is silicon, which is extracted from quartz sand, and the wafer is the silicon element to be purified (99.999%). Then, some pure silicon is made into silicon crystal rods, which become the materials for semiconductor manufacturing integrated circuits, and their slices are the wafers specially needed for chip manufacturing. The thinner the wafer, the lower the production cost, but the higher the requirements for the process.
2. Wafer coating Wafer coating can resist oxidation and high temperature, and its material is a photoresist.
3. Photolithography, development and etching of wafers use chemicals sensitive to ultraviolet rays, which will soften when exposed to ultraviolet rays. The shape of the chip can be obtained by controlling the position of the light shielding plate. A photoresist is coated on the silicon wafer so that it will dissolve when exposed to ultraviolet light.
4. Dope impurities and implant ions into the wafer to produce corresponding P and N semiconductors. The specific process is to start from the exposed area on the silicon wafer and put it into the mixed solution of chemical ions. This process will change the conduction mode of the doped region, so that each transistor can be turned on, off or carry data.
5. Wafer testing After the above process, lattice particles are formed on the wafer. The electrical characteristics of each crystal grain are detected by a pin test.
6. Packaging: Fix the manufactured wafer, bind the pins, and make it into various packaging forms as needed, which is why the same chip core can have different packaging forms. For example: Dipper, QFP, PLCC, QFN, etc. This is mainly determined by external factors such as users' application habits, application environment and market form.
7. The last process of chip manufacturing is testing, which can be divided into general testing and special testing. The former is to test the electrical characteristics of the packaged chip in various environments, such as power consumption, operating speed, withstand voltage and so on.
Legal basis:
Criminal law of the people's Republic of China
Article 225
Whoever, in violation of state regulations, commits one of the following illegal business operations and disrupts the market order, if the circumstances are serious, shall be sentenced to fixed-term imprisonment of not more than five years or criminal detention, and shall also, or shall only, be fined not less than one time but not more than five times the illegal income; If the circumstances are especially serious, he shall be sentenced to fixed-term imprisonment of not less than five years, and shall also be fined not less than one time but not more than five times for illegal gains or confiscation of property:
(a) without permission, the franchise, monopoly of goods or other goods restricted by laws and administrative regulations;
(2) buying and selling import and export licenses, import and export certificates of origin and other business licenses or approval documents stipulated by laws and administrative regulations;
(three) without the approval of the relevant competent departments of the state, illegally engaged in securities, futures, insurance business, or illegally engaged in fund payment and settlement business;
(four) other illegal business activities that seriously disrupt the market order.