There are several problems to be solved in copper cladding: first, the single point connection in different places is completed by 0 ohm resistance or magnetic beads or inductance; The second is the copper cladding near the crystal oscillator. The crystal oscillator in the circuit is a high frequency transmitter. The method is to plate copper around the crystal oscillator, and then ground the crystal oscillator shell separately. Third, the island (dead zone) problem. If it is very large, it won't take long to define a ground via and add it.
In addition, it is better to cover copper in a large area or in a grid, and it is not good to generalize. Why? If a large area is covered with copper, the circuit board may warp or even blister during wave soldering. From this point of view, the heat dissipation of the grid is better. Usually, it is a multi-purpose grid with high anti-interference requirements for high-frequency circuits, and the high-current low-frequency circuits are completely covered with copper. However, a great warrior once told me that for signals above 1GHz, the impedance must be matched and the reflecting surface must be covered with copper!
Personal experience: at the beginning of wiring, the ground wire should be treated equally. When wiring, the ground wire should be connected. It is not possible to eliminate the connected grounding pin by adding vias after copper cladding. This influence is very bad. Of course, if the grid is covered with copper, these ground wires will affect the appearance. If you are careful, delete them.
Finally, summarize the advantages of copper cladding: improving power efficiency and reducing high-frequency interference, which looks beautiful!
By the way, you are asking the wrong place when you ask about the copper clad here. This is a problem in the futures market.