on may 7th, changdian technology announced that the company had raised about 5 billion yuan, more than half of which came from domestic and foreign head investment institutions such as Abu Dhabi sovereign wealth fund, JP Morgan, guangfa fund and zhengxin valley.
according to the previous announcement, changdian technology issued 177 million RMB ordinary shares (a shares) to 23 specific targets at a price of RMB 28.3/share, and raised 5 billion yuan, which was mainly invested in "project with an annual output of 3.6 billion high-density integrated circuits and system-level packaging modules" and "project with an annual output of 1 billion high-density hybrid integrated circuits and modules for communication". According to the company, this fundraising will help to develop the packaging capabilities such as SiP (System Packaging), QFN (Four-sided Flat Package) and BGA (ball grid array package), better meet the packaging needs of terminal applications such as 5G communication equipment, big data and automotive electronics, and further promote the development of 5G technology in the commercial field of China.
with the chip size getting smaller and smaller, there are more and more kinds of chips, and the number of input and output pins increases greatly, the development of 3D packaging, fan-shaped packaging (FOWLP/PLP), micro-pitch wire bonding technology and SiP technology has become one of the best choices to continue Moore's Law. The semiconductor packaging and testing industry is also transitioning from traditional packaging and testing to advanced packaging and testing technology, and the proportion of advanced packaging technology in the whole packaging market is gradually increasing.
according to the data of Yole, a market research organization, the global market size of advanced packaging was about 27.6 billion dollars in 218, accounting for about 42.1% of the global packaging market. It is estimated that the global market size of advanced packaging will be about 43.6 billion dollars in 224, accounting for about 49.7%, and the CAGR of the global advanced packaging market will be about 8% from 218 to 224, compared with the overall packaging market in the same period (CAGR=5%).
in addition to the evolution to advanced packaging and testing, the demand of packaging and testing industry is also rising. Benefiting from the wave of localization of integrated circuits, the application of new technologies such as intelligence, 5G, Internet of Things and electric vehicles, and the "home economy" caused by the epidemic have also brought about a great increase in the demand for electronic terminals such as PCs, servers and video games. Semiconductor wafers and packaging and testing capacity are in short supply, which has also boosted the performance of packaging and testing manufacturers.
In 22, the revenue of Changdian Technology was RMB 26.46 billion, an increase of 28.2% over the previous year, and its net profit exceeded twice the total net profit of the company in the 17 years since its listing. Tongfu Microelectronics achieved an operating income of 1.769 billion yuan in 22, an increase of 3.27% over the same period of last year, and a net profit of 338 million yuan, an increase of 1,668.4% over the same period of last year. Huatian Technology's revenue in 22 was 8.382 billion yuan, up 3.44% year on year, and its net profit was 72 million yuan, up 144.67% year on year.
the huge market demand leads to the shortage of semiconductor supply chain and production capacity, which is difficult to solve in the short term. Tongfu Microelectronics said that at present, the semiconductor industry is in a high boom cycle, and the shortage and price increase caused by tight production capacity supply have spread all over many links in the industry. From design to wafer to packaging and testing, we have negotiated with customers to increase prices. The situation of tight semiconductor production capacity will continue for a long time. "Semiconductor packaging and testing capacity has been in short supply for a long time. The company can take this opportunity to communicate and negotiate with customers, adjust the cost structure and price, and improve the efficiency of capacity utilization. On the one hand, it will drive the company's profitability to rebound, on the other hand, it will realize the benign and sustainable development of the company and customers. "
Zheng Li, CEO and director of Changdian Technology, said in a recent forum that the capacity shortage will be alleviated to some extent in September this year. At the performance meeting, he said that the three sealing and testing plants purchased by the company in Singapore are expected to be put into production in 221.