Chinese mainland wafer manufacturers represented by SMIC have produced the most advanced 28 nm process, which is 2-3 generations behind the global advanced mainstream process1614 nm and the upcoming 10 nm.

It used to be a four-year cycle, but now it is a one-year cycle. China enterprises are struggling to catch up, but overseas chip giants will not stop. Intel, Samsung and TSMC have announced plans for 7 nm, 5 nm and even mass production.

According to the goal set by the National Outline for the Development and Promotion of Integrated Circuit Industry, by 2020, China's 16/ 14 nano wafer manufacturing process will be mass-produced. Wei Shaojun believes that if we still follow the traditional structure and the pace of development, we will always lag behind others. Therefore, it is particularly important to innovate from the underlying architecture of chip design.

At the same time, as the support of the semiconductor industry, the gap between equipment and materials is the biggest. Wei Jun, vice president of the China National Foundation, bluntly said, "The gap between equipment and materials is not generally large, and even a suitable investment target cannot be found."

"The most difficult thing is the material. Several of our companies are engaged in the production of silicon wafers, but the manufacture of integrated circuits involves a variety of metals and chemical consumables, so overseas companies are really stuck with us. The state's support for these areas needs to be strengthened. " Chen Datong told china securities journal that in terms of equipment, the national 02 special project ("Very Large Scale Integrated Circuit Manufacturing Technology and Complete Process" project) launched in 2006 played a role in sowing seeds, supported many equipment companies and made almost every kind of semiconductor equipment, but the market competitiveness was far from perfect.