MX’s CPU should be 28nm, which generates very little heat and is very energy-saving. It should be TI4460 and TI4470, OMAP5430 is also very possible, and the possibility is extremely high, you can read the introduction.
This is the 4-core A15 OMAP5430 processor information from the official website of Texas Instruments
J.Wong said: The mobile phone MHL still feels not very practical. I want to use the A15 multi-core to make a small size belt How about using a hard drive as a media center (without a display), or even installing Windows 8 as a computer host
The only 4-core processors currently released using the Cortex-A15 architecture are Texas Instruments' OMAP5430, released by Qualcomm and Nvidia None of the 4-core processors are based on the A15 architecture.
For the MX dual-core mobile phone processor, it is impossible for Meizu to develop CPU solutions from two companies at the same time, so the MX dual-core can only use the Texas Instruments OMAP4 platform. It is introduced on the Texas Instruments official website. You can first have a look.
Texas Instruments official website:
TI Homepage> Wireless Solutions for Handheld Terminals> OMAP? Application Processor> OMAP? 5 Platform> OMAP5430
OMAP ? 5 Platform: OMAP5430
clear gif
Chip Block Diagram | OMAP? 5 Key Benefits | White Paper | System Block Diagram | Video | Press Release
Chip Block Diagram
p>OMAP5430 chip block diagram - thumbnail
Enlarge to enlarge
OMAP5430 main advantages
Designed to drive smart phones, writing tablets and other devices with rich multimedia Designed for functional mobile devices
Multi-core ARM? Cortex? processor
Two ARM Cortex-A15 MP core processors with speeds up to 2GHz
Two ARM Cortex-M4 processors enable low-power loads and real-time response
Multi-core POWERVR? SGX544-MPx graphics accelerator drives 3D games and 3D user interfaces
Dedicated TI 2D BitBlt Graphics Accelerator
IVA-HD hardware accelerator enables Full HD 1080p60, multi-standard video encoding/decoding and 1080p30 Stereoscopic 3D (S3D)
Faster, higher quality images and video capture function, with up to 24 million pixels (or 12 million pixels S3D) imaging and 1080p60 (or 1080p30S3D) video capabilities
Supports four cameras and four displays working simultaneously
Packaging and memory: 14mm x 14mm, 0.4mm pitch PoP dual-channel LPDDR2 memory
Features enable
28nm CMOS low-power processing for the highest levels of processor performance and lowest power Consumption
Multi-core ARM architecture with symmetric multi-processing (SMP) capabilities, including 2 ARM Cortex-A15 MP core processors and 2 ARM Cortex-M4 processors
Higher Mobile computing performance
Performance increased by 2-3 times compared to the previous generation
Faster user interface and lower power consumption
SMP scalability Performance activates only the cores required for a particular process
Hardware virtualization functions in the hypervisor enable low power consumption and high performance, supporting multiple guest operating systems (OS)
IVA 3 HD Multimedia Accelerator
Full HD 1080p60 multi-standard video encoding/decoding
Hardwired codecs provide high performance at low power levels
Programmable DSP provides flexibility for future codecs
Supports HD stereoscopic movie 3D encoding/decoding (1080p30)
Multi-Imagination Technologies’ POWERVR? SGX544-MPx graphics core< /p>
Performance increased by 5 times compared to the previous generation
Eye-catching 3D graphics interface
Supports ultra-large screens at higher frame rates per second, and Lower power consumption than previous cores
Supports all major APIs including: OpenGL? ES v2.0, OpenGL? ES v1.1, OpenCL v1.1, OpenVG v1.1 and EGL v1. 3
Multi-core imaging
and Vision Processing Unit
Enhanced image quality, up to 24MP 2D or 12MP S3D
Faster system performance
Fewer external components
Lower system cost
Lower system power consumption
M-Shield? mobile security technology is enhanced with ARM TrustZone? support and is based on Open API
Content Protection
Transaction Security
Secure Network Access
Secure Flash and Boot
Terminal Identity Protection
Network Lockout Protection
SmartReflex? 3 Technology
Further reduce power consumption
Based on device activity, operating mode and temperature Dynamically control voltage, frequency and power
Ultra-low voltage holdover support
TI power management/audio codec companion device support
Maximizes battery life Longevity
Improved system performance
Significantly reduced board area and system cost
Efficient management of power consumption and audio functions
Low Power Audio
Delivers over 140 hours of CD-quality audio playback
Complete software suite
Speeds time to market
Lower R&D costs
Ensure maximum performance in customer handheld terminals
Support features
Up to 4 simultaneous, high-resolution, color-rich LCD displays supported
HDMI 1.4a output drives HD displays, including S3D
MIPI Serial Camera and Serial Display Interface
MIPI? SLIMbusSM
< p> MMC/SDUSB 3.0 OTG Super Speed ??with integrated PHY interface
Complete software suite supports all major mobile operating systems and is fully integrated and tested with real-world usage for Reducing development time and costs
The OMAP Developer Network provides programming and media components for manufacturers to develop unique products that can be quickly brought to market
OMAP5430 OMAP5432
Target market area-sensitive applications (smartphones, writing tablets) Low-cost applications (mobile computing, consumer products)
Processing node 28nm low-power processing
ARM? Cortex? -A15 Clock speed (two) Up to 2GHz
2D and 3D graphics multi-core, hardware acceleration
Video performance (2D) 1080p60 multi-standard
Video performance ( 3D) 1080p30 multi-standard
Imaging performance up to 24MP
(MIPI? CSI-3+ 3 MIPI? CSI-2+ CPI interfaces) up to 20MP
(3 CSI-2+ CPI interfaces)
Memory supports 2 LPDDR2 and 2 DDR3/DDR3L
Peripherals support UART (6), HSIC (3), SPI (4), MIPI? UniPortSM
-M, MIPI? LLI, HSI (2 pcs)
UART (5 pcs), HSIC (2 pcs), SPI (3 pcs)
MIPI? UniPortSM-M, MIPI ? LLI, HSI
Package 14mm x 14mm PoP
980 solder balls
0.4mm pitch (240 balls, 0.5mm PoP) I/F 17mm x 17mm BGA
754 solder balls
0.5mm pitch (with depop)
System block diagram
OMAP5430 chip block diagram - thumbnail
p>Zoom in
Video
{SEO}
Press release
Change date headline
< p>February 7, 2011 More Than Maxima: TI's OMAP? 5 Platform Changes the Concept of "Mobile"Supply Disclaimer
This product is intended for high-volume mobile OEMs Used with ODM and not sold through dealers. If your company fits the description above, please contact your local TI sales office.
OMAP and SmartReflex are trademarks of Texas Instruments Incorporated. Other product or service names mentioned in this document are the trademarks of their respective companies.
Chip Block Diagram | OMAP? 5 Key Benefits | White Paper | System Block Diagram | Video | Press Release
Chip Block Diagram
OMAP5430 Chip Block Diagram - Thumbnail
Zoom in Zoom
OMAP5430 Key Benefits
Designed to drive smartphones, writing tablets and other mobile devices with rich multimedia capabilities
Multi-core ARM? Cortex? Processors
Two ARM Cortex-A15 MP core processors with speeds up to 2GHz each
Two ARM Cortex-M4 processors enable low power loads and real-time response
Multi-core POWERVR? SGX544-MPx graphics accelerator drives 3D games and 3D user interfaces
Dedicated TI 2D BitBlt graphics accelerator
IVA-HD hardware Accelerators enable Full HD 1080p60, multi-standard video encoding/decoding, and 1080p30 Stereoscopic 3D (S3D)
Faster, higher-quality image and video capture with up to 24 million pixels (or 12 million pixels) Pixel S3D) imaging and 1080p60 (or 1080p30S3D) video function
Supports four cameras and four displays working simultaneously
Packaging and memory: 14mm x 14mm, 0.4mm pitch PoP dual Channel LPDDR2 memory
Features enable
28nm CMOS low-power processing for the highest levels of processor performance and lowest power consumption
With Symmetric Multi-Processing (SMP ) features multi-core ARM architecture, including 2 ARM Cortex-A15 MP core processors and 2 ARM Cortex-M4 processors
Higher mobile computing performance
Performance compared to the previous generation 2-3 times improvement on the basis
Faster user interface and lower power consumption
The scalable performance of SMP will only activate the cores required for the special process
Hardware virtualization in the hypervisor enables low power consumption and high performance, supporting multiple guest operating systems (OS)
IVA 3 HD multimedia accelerator
Full HD 1080p60 Multi-standard video encoding/decoding
Hardwired codecs provide high performance at low power levels
Programmable DSP provides flexibility for future codecs
p>
Supports high-definition stereoscopic movie 3D encoding/decoding (1080p30)
Multi-Imagination Technologies’ POWERVR? SGX544-MPx graphics core
Performance has been improved on the previous generation 5x faster
Compelling 3D graphics interface
Supports larger screens at higher frame rates per second and consumes less power than previous cores
Supports all major APIs including: OpenGL? ES v2.0, OpenGL? ES v1.1, OpenCL v1.1, OpenVG v1.1 and EGL v1.3
Multi-core imaging and vision processing unit
Enhanced image quality, up to 24MP 2D or 12MP S3D
Faster system performance
Fewer external components
Lower system cost
Lower system performance
M-Shield? mobile security technology is enhanced with ARM TrustZone? support and is based on open APIs
Content protection
Transaction security
Secure Network Access
Secure Flash and Boot
Endpoint Identity Protection
Network Lockout Protection
SmartReflex? 3 Technologies< /p>
Further reduce power consumption
Dynamically control voltage, frequency and power based on device activity, operating mode and temperature
Ultra-low voltage holdover support
< p>TI Power Management/Audio Codec Companion Device SupportMaximizes battery life
Improves system performance
Significantly reduces circuitry board area and system cost
Efficiently manage power consumption and audio capabilities
Low-power audio
Provides over 140 hours of CD-quality audio playback
Complete software suite
Accelerate time to market
Lower R&D costs
Ensure maximum performance in customer handheld terminals
Supported features
Up to 4 simultaneous, high-resolution, colorful LCD displays supported
HDMI 1.4a output can drive HD displays, including S3D
< p> MIPI Serial Camera and Serial Display InterfaceMIPI? SLIMbusSM
MMC/SD
USB 3.0 OTG Super Speed ??with Integrated PHY Interface
p>Complete software suite supports all major mobile operating systems and is fully integrated and tested with real-world usage to reduce development time and costs
OMAP Developer Network provides application and media components for Manufacturers develop unique products that can be brought to market quickly
OMAP5430 OMAP5432
Target market area-sensitive applications (smartphones, writing tablets) Low-cost applications (mobile computing, consumer products)
Processing Node 28nm Low Power Processing
ARM? Cortex?-A15 Clock Speed ??(Two) Up to 2GHz
2D and 3D Graphics Multi-Core, Hardware Acceleration
Video performance (2D) 1080p60 multi-standard
Video performance (3D) 1080p30 multi-standard
Imaging performance up to 24MP
( MIPI? CSI-3+ 3 MIPI? CSI-2+ CPI interface) up to 20MP
(3 CSI-2+ CPI interface)
Memory supports 2 LPDDR2 2 DDR3/DDR3L
Peripherals support UART (6 pcs), HSIC (3 pcs), SPI (4 pcs), MIPI? UniPortSM-M, MIPI? LLI, HSI (2 pcs)
UART (5 pcs), HSIC (2 pcs), SPI (3 pcs)
MIPI? UniPortSM-M, MIPI? LLI, HSI
Package 14mm x 14mm Po
P
980 solder balls
0.4mm pitch (240 balls, 0.5mm PoP) I/F 17mm x 17mm BGA
754 solder balls
0.5mm pitch (with depop)
System block diagram
OMAP5430 chip block diagram - thumbnail
Enlarge to enlarge
Video
{SEO}
Press release
Change date headline
February 7, 2011 More than Maxima: TI’s OMAP ? 5 Platform Changes the Concept of "Mobile"
Supply Disclaimer
This product is intended for use by high-volume mobile OEMs and ODMs and is not sold through resellers. If your company fits the description above, please contact your local TI sales office.
OMAP and SmartReflex are trademarks of Texas Instruments Incorporated. Other product or service names mentioned in this document are the trademarks of their respective companies.