1. Wei Wei, from Guang Chen. Analysis of Upper Bound Solution of Equal Channel Angular Extrusion Journal of Metastable and Dynamics. Nanocrystalline materials, 2004,23:109-112 (included in EI).
2. Wei Wei and Wang. Effect of external arc angle on mechanical properties of bulk ultra-fine grained pure copper. TMS Annual Meeting 2004, North Carolina, USA. Page 155- 160 (provided by EI and ISTP).
3. Wei Wei, Wei Wei, Qing. Grain refinement of copper plate by cumulative rolling at room temperature. 2006 TMS Annual Meeting, San Antonio, Texas, USA. (including EI and ISTP)
4. Wei Wei, Chen Guangren. Preparation of bulk nanomaterials by large plastic deformation. Journal of Mechanical Engineering, 2002,38 (7):1-5
5. Wei Wei. Extrusion die for porous metal-based carrier. (utility model) patent number: ZL 0 1 2 73093.9
Presided over the research project: SPD technology and high performance research of conventional materials, Science and Technology Development Fund of Jiangsu University of Science and Technology (2005~2007).