IC English network language, IC = I see!

[Edit this paragraph] Medical terminology

Immune complex is also called antigen-antibody complex.

[Edit this paragraph] Integrated circuit industry

Definition of integrated circuit

IC is the general name of semiconductor components. Include: 1. Integrated circuit (IC); 2. Second, triode; 3. Special electronic components.

More broadly, it also involves all electronic components, such as resistors, capacitors, circuit boards /PCB boards and many other related products.

Development and reform of integrated circuit industry

Since 1958, Texas Instruments (TI) invented integrated circuit (IC), with the development of silicon plane technology, bipolar and MOS integrated circuits were invented in 1960s, which marked a quantitative and qualitative leap in the era of electron tubes and transistor electronic devices, and created a new integrated circuit industry with unprecedented penetration and vitality.

Looking back on the development of integrated circuits, we can see that the phrase "from circuit integration to system integration" is the best summary of the development process of IC products from small-scale integrated circuits (SSI) to today's very large-scale integrated circuits (ULSI), that is, the development of the whole integrated circuit products has changed from the traditional system level to the system level. In this historical process, in order to adapt to the development of technology and the demand of the market, the industrial structure of the world integrated circuit industry has undergone three changes.

The first transformation: the initial stage of the development of integrated circuit industry dominated by processing and manufacturing.

In 1970s, the mainstream products of integrated circuits were microprocessors, memories and standard general logic circuits. During this period, integrated circuit manufacturers (IDM) played a major role in the integrated circuit market, and integrated circuit design only existed as a subsidiary department. At this time, integrated circuit design is closely related to semiconductor technology. IC design is mainly manual, and CAD system is only used for data processing and graphic programming. The integrated circuit industry is only in the primary production-oriented stage.

The second revolution: the rise of foundry and IC design companies.

In 1980s, the mainstream products of integrated circuits were microprocessor (MPU), microcontroller (MCU) and application specific integrated circuit (ASIC). At this time, the combination of Fabless and OEM without production line began to become a new model for the development of integrated circuit industry.

With the wide application and popularization of microprocessors and PCs (especially in communication, industrial control, consumer electronics and other fields), the integrated circuit industry has begun to enter a customer-oriented stage. On the one hand, IC with standardized functions can hardly meet customers' requirements for system cost and reliability. At the same time, the customers of the whole machine demand to continuously improve the integration of IC, improve the confidentiality, reduce the chip area, reduce the system volume, reduce the cost and improve the cost performance of products, thus enhancing the competitiveness of products and gaining more market share and more lucrative profits. On the other hand, due to the progress of integrated circuit micromachining technology, it is possible to hardware the software. In order to improve the speed of the system and simplify the program, ASIC with various hardware structures, such as gate array, programmable logic device (including FPGA), standard cell and fully customized circuit, appeared, accounting for 12% of the total IC sales. Thirdly, with the development of EDA tools (electronic design automation tools), PCB design methods are introduced into ic design, such as the concept of library, process simulation parameters and their simulation concepts, and the design begins to enter the abstract stage, so that the design process can exist independently of the production process. Seeing the market and development prospect of ASIC, far-sighted machine manufacturers and entrepreneurs, including venture capital funds (VC), began to set up professional design companies and IC design departments, and fabless integrated circuit design companies or design departments without production lines were established and developed rapidly. At the same time, it also led to the rise of standard manufacturing lines. The first foundry in the world is Taiwan Province Integrated Circuit Company, which was established in 1987. Its founder, Zhang Zhongmou, is also called "the father of wafer processing".

The Third Reform: Integrated Circuit Industry with "Four Industries Separated"

In the 1990s, with the rise of the Internet, the integrated circuit industry entered an advanced stage of competition-oriented, and the international competition changed from the original resource competition and price competition to talent knowledge competition and capital-intensive competition. The competition mode of expanding equipment investment with DRAM as the center has become a thing of the past. For example, in 1990, the United States, represented by Intel, voluntarily abandoned the DRAM market, engaged in CPU, made major structural adjustments to the semiconductor industry, and regained the world's semiconductor hegemony. This makes people realize that the increasingly huge integrated circuit industry system is not conducive to the development of the entire integrated circuit industry. Only "division of labor" can be refined and "integration" can become an advantage. As a result, highly specialized industrial structure of integrated circuits has become a trend, and the situation that design industry, manufacturing industry, packaging industry and testing industry are independent has begun to take shape. In recent years, the development of global integrated circuit industry has increasingly shown the advantages of this structure. For example, the integrated circuit industry in Taiwan Province Province is dominated by small and medium-sized enterprises, forming a highly differentiated industrial structure. Therefore, since 1996, affected by the Asian economic crisis, the global semiconductor industry has overcapacity and its benefits have declined, while the integrated circuit design industry has achieved sustained growth.

Especially in 1996, 1997 and 1998, the price of DRAM fell, and MPU fell for three years. The growth rate of the world semiconductor industry has been far lower than the previous growth value 17%. If we rely on high-input upgrading technology, pursue large-size silicon wafers and micromachining, reduce costs, and promote its growth from mass production, it will be unsustainable. And IC design enterprises are closer to and understand the market, and directly promote the upgrading of electronic systems through innovative development of high value-added products; At the same time, gain profits from innovation, accumulate capital on the basis of rapid and coordinated development, and drive the renewal and new investment of semiconductor equipment; As the "leader" of the integrated circuit industry, the integrated circuit design industry has injected new impetus and vitality into the growth of the entire integrated circuit industry.

Integrated circuit design, production and sales model

At present, integrated circuit products have the following design, production and sales models.

1.IC manufacturers (IDM) design, process, package and test the finished chips themselves.

2. The combination of no factory and OEM. The design company will hand over the final physical layout of the designed chip to the foundry for processing and manufacturing. Similarly, the packaging test is also entrusted to professional manufacturers, and the final finished chip is sold as the product of IC design company. For example, Fabless is equivalent to the author and publisher, and Foundry is equivalent to the printing house, and the former should play a leading role in the industry.

Industry standard of integrated circuit product grade

The definition of product grade is mainly based on the outer packaging of the product, and the grades are arranged alphabetically from A to E:

A 1 grade: original factory production, original factory packaging and complete anti-static packaging (note: products from regular channels or independent distributors have the highest reliability within the specified warranty period. That is, "brand new original goods")

A2 grade: original factory production, original factory packaging, incomplete anti-static packaging, opened (note: from regular channels or independent distributors, within the specified warranty period. That is, "brand new goods")

A3 level: original factory production (description: factory backlog or surplus materials, unified batch number. It is possible that the production date is earlier. I.e. "factory surplus")

Note: Grades A 1, A2 and A3 are collectively referred to as "new goods" in the market.

B 1 grade: the original factory is unpacked or unpacked and unused, and may be repackaged by the seller (note: it is produced by the original factory, but for some reasons it is unpacked and the product batch number is uniform, so it is uniformly marked by the original factory. If it flows into the market through special channels, the reliability of product quality is uncertain)

Category B2: non-original packaging or no packaging, unused, and may be repackaged by the seller (Note: original factory production, but for some reasons, the product surface is not printed with words, and the quality and reliability of the product are uncertain. Generally, such products will be uniformly re-labeled by dealers)

B3: It was not packaged or unpacked by the original factory, but it may have been repackaged by the seller (Note: it was produced by the original factory, but for some reasons, it was not packaged and the product batch number was not uniform, so it was uniformly marked by the original factory. If it flows into the market through special channels, the reliability of product quality is uncertain. Generally, such products will be uniformly re-labeled by dealers)

Category B4: Unused, with packaging (Note: it was manufactured by the original factory, but the storage environment of the product is not suitable, or the product has been stored for too long. Product pin oxidation. Product quality is uncertain)

Note: Grades B 1, B2, B3 and B4 are collectively referred to as "scattered new goods" in the market.

C 1 grade: non-original production, brand new and unused, with complete packaging (Note: some products produced in Chinese mainland, Taiwan Province Province or other overseas countries or regions are completely packaged according to the original brand specifications, with the same function and the words of original brand manufacturer printed on them. The product quality is uncertain. The quality and reliability are not as good as the original. I.e. "imitation")

C2 level: brand new and unused (Description: products with the same or similar functions are replaced by another product logo after removing the original logo. That is, "Daizi", and the market is collectively referred to as "Daizi")

D 1 grade: unopened, used, the pin code of the product is undamaged, and it belongs to second-hand goods. It may be repackaged by the seller (note: it can be directly pulled out from the old circuit board, such as some DIP, PLCC, BGA packages. That is, "second-hand goods")

D2: Unpackaged second-hand goods. It may have been repackaged by the seller (note: it was directly removed from the old circuit board, and the pins were cut short. This product can be post-treated, and the shortened needle can be lengthened or lengthened. I.e. "old movie clips")

D3: unopened, second-hand. It may have been repackaged by the seller (note: it was removed from the old circuit board and the pins were stained with solder. And rework the pin. That is, "old movies")

D4 grade: unopened, second-hand goods. It may have been repackaged by the seller (note: it was removed from the old circuit board and the pins were stained with solder. Re-process the pin. Re-bid. I.e. "old-fashioned repair sheets")

D5 Grade: Unpackaged second-hand goods. It may be repackaged by the seller (note: second-hand, but it is a programmable device, and the built-in program cannot be erased)

Note: Grades D 1, D2, D3 and D5 are collectively referred to as "secondhand goods" in the market.

E 1: Unpackaged goods. It may have been repackaged by the seller (note: it was produced by the original factory, and the product quality failed the quality inspection. What should have been destroyed is circulated to the market through special channels. The quality is unreliable. That is, "substandard", the market is collectively referred to as "defective products")

E2: Unpackaged goods. May be repackaged by the seller (note: some products have been changed from industrial grade to military grade. The quality is very unstable and there are great security risks. That is, "upgrade", the market is collectively referred to as "fake goods")

E3: Unpackaged goods. May be repackaged by the seller (note: hit the product that the customer needs with completely irrelevant products. Some have the same appearance, while others have different appearances. That is, "fake and shoddy", and the market is collectively referred to as "fake goods")

T 1 grade: complete packaging (description: products customized by the original factory for specific users. It is possible to use only the user's products)

T2 level: complete package (note: the original chip wafer is used for third-party package. The product quality is generally reliable. Usually discrete chips)

Note: T 1 and T2 are collectively referred to as "special products" in the market.

Classification of common electronic components

The classification of common electronic components is based on a variety of methods. The following is a summary of common categories:

First of all, electronic components have their own independent circuit functions and constitute the basic unit of the circuit. With the development of electronic technology, there are more and more varieties and functions of components, and the scope involved is also expanding, spanning the traditional classification of components, circuits and systems and the basic categories of hardware and software.

Fundamentally speaking, basic circuit components can be roughly divided into active components and passive components. For components made of semiconductors, devices and integrated devices can also be separated. According to the purpose, it can also be divided into: basic circuit elements, switching elements, connectors, indicating or displaying devices, sensors and so on.

Passive device is a kind of component that only consumes the input signal electric energy of the component, and can process and transmit the signal without power supply.

Passive devices include resistors, potentiometers, capacitors, inductors, diodes, etc.

The basic condition for active devices to work normally is that corresponding power supply must be provided. Without power supply, these devices will not work. Active devices, including triodes, field effect transistors, integrated circuits, etc. Is a semiconductor-based component.

With the development of integrated circuits, unit circuits, functional circuits and even the whole electronic system are integrated together.

Classification of integrated circuits

(A) by functional structure classification

Integrated circuits can be divided into analog integrated circuits and digital integrated circuits according to different functions and structures.

Analog integrated circuits are used to generate, amplify and process various analog signals. Such as audio signals of transistor radios, tape signals of tape recorders, etc. ), and digital integrated circuits are used to generate, amplify and process various digital signals (signals with discrete values in time and amplitude). E.g., audio signals and video signals played back by VCD and DVD).

Basic analog integrated circuits include operational amplifiers, multipliers, integrated voltage regulators, timers, signal generators, etc. There are many kinds of digital integrated circuits, and there are also many kinds of gate circuits in small-scale integrated circuits, namely NAND gate, NOT gate and OR gate. Medium-scale integrated circuits include data selectors, codecs, triggers, counters, registers, etc. Large-scale or very large-scale integrated circuits include PLD (programmable logic device) and ASIC (application specific integrated circuit).

From the perspective of PLD and ASIC, the difference between components, devices, circuits and systems is not very strict. Moreover, PLD device itself is only a hardware carrier, and different circuit functions can be realized by loading different programs. Therefore, modern devices are not pure hardware, and software devices and corresponding software electronics have been widely used in modern electronic design, and their status is becoming more and more important.

There are many kinds of circuit elements. With the continuous improvement of electronic technology and technology, a large number of new devices appear constantly, and the same device also has many packaging forms. For example, patch components can be seen everywhere in modern electronic products. For different use environments, the same equipment also has different industrial standards. There are usually three standards for domestic components, namely, civil standards, industrial standards and military standards. Different standards have different prices. The price of military standard devices may be ten times or more than that of civilian standards. Industrial standards are somewhere in between.

(2) Classification by production process

Integrated circuits can be divided into semiconductor integrated circuits and thin-film integrated circuits according to their manufacturing processes.

Thin film integrated circuits are divided into thick film integrated circuits and thin film integrated circuits.

(3) Classification by degree of integration

Integrated circuits are divided into small-scale integrated circuits (SSI), medium-scale integrated circuits (MSI), large-scale integrated circuits (LSI), very large-scale integrated circuits (VLSI) and very large-scale integrated circuits (ULSI).

(4) According to the different types of conductivity.

Integrated circuits can be divided into bipolar integrated circuits and unipolar integrated circuits according to conductivity types.

Bipolar integrated circuits have complex manufacturing process and high power consumption, that is to say, there are TTL, ECL, HTL, LST-TL, STTL and other types of integrated circuits. Monopolar integrated circuits are simple in manufacturing process, low in power consumption and easy to be made into large-scale integrated circuits. The representative integrated circuits are CMOS, NMOS and PMOS.

(5) Classification by purpose

Integrated circuits can be divided into integrated circuits for TV sets according to their uses. Integrated circuits of audio, DVD player, video recorder, computer (microcomputer), electronic organ, communication, camera, remote control, language, alarm and various special integrated circuits.

Integrated circuits for TV sets include line and field scanning integrated circuits, intermediate amplifier integrated circuits, audio integrated circuits, color decoding integrated circuits, AV/TV conversion integrated circuits, switching power supply integrated circuits, remote control integrated circuits, Li Yin decoding integrated circuits, picture-in-picture processing integrated circuits, microprocessor (CPU) integrated circuits, memory integrated circuits, etc.

Audio integrated circuits include AM/FM high and intermediate frequency circuits, stereo decoding circuits, audio preamplifier circuits, audio operational amplifier integrated circuits, audio power amplifier integrated circuits, surround sound processing integrated circuits, level drive integrated circuits, electronic volume control integrated circuits, delayed reverberation integrated circuits, electronic switch integrated circuits, etc.

The integrated circuits of DVD player include system control integrated circuits, video coding integrated circuits, MPEG decoding integrated circuits, audio signal processing integrated circuits, sound effect integrated circuits, RF signal processing integrated circuits, digital signal processing integrated circuits, servo integrated circuits, motor driving integrated circuits and so on.

The integrated circuits of video recorders include system control integrated circuits, servo integrated circuits, drive integrated circuits, audio processing integrated circuits and video processing integrated circuits.